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Features
* Low-voltage and Standard-voltage Operation * * * * * * * * *
- VCC = 1.7 to 5.5V Internally Organized 4096 x 8, 8192 x 8 2-Wire Serial Interface Schmitt Trigger, Filtered Inputs for Noise Suppression Bi-directional Data Transfer Protocol 1MHz (5.0V) and 400KHz (1.8V Compatibility) Write Protect Pin for Hardware Data Protection 32-Byte Page Write Mode (Partial Page Writes Allowed) Self-Timed Write Cycle (5ms max) High Reliability - Endurance: 1 Million Write Cycles - Data Retention: 100 Years Lead-free/Halogen-free Devices 8-lead JEDEC SOIC, 8-lead TSSOP, 8-lead UDFN, 8-lead XDFN, 5-lead SOT23 and 8-ball VFBGA Die Sales: Wafer Form, Waffle Pack and Bumped Wafers
* * *
2-Wire Serial Electrically Erasable and Programmable Read-only Memory
32K (4096 x 8) 64K (8192 x 8)
Description
The Atmel(R) AT24C32D/64D provides 32,768-/65,536-bits of serial electrically erasable and programmable read only memory (EEPROM) organized as 4096/8192 words of 8-bits each. The device's cascadable feature allows up to eight devices to share a common 2-wire bus. The device is optimized for use in many industrial and commercial applications where low power and low voltage operation are essential. The AT24C32D/64D is available in space saving 8-lead JEDEC SOIC, 8-lead TSSOP, 8lead UDFN, 8-lead XDFN, 5-lead SOT23 and 8-ball VFBGA and is accessed via a 2wire serial interface. In addition, the entire family operates from 1.7V to 5.5V. Table 0-1.
Pin Name A0 - A2 SDA SCL WP Note:
Atmel AT24C32D Atmel AT24C64D
Pin Configurations
Function Address Inputs Serial Data Serial Clock Input Write Protect
A0 A1 A2 GND
8-lead SOIC
1 2 3 4 8 7 6 5
8-lead TSSOP VCC WP SCL SDA A0 A1 A2 GND
1 2 3 4 8 7 6 5
VCC WP SCL SDA
2-Wire, 32K Serial E2PROM
8-lead UDFN VCC WP SCL SDA
8 7 6 5 1 A0 2 A1 3 A2 4 GND
8-lead XDFN VCC 8 WP 7 SCL 6 SDA 5
1 A0 2 A1 3 A2 4 GND
For use of 5-lead SOT23, the software A2, A1, and A0 bits in the device address word must be set to zero to properly communicate
Bottom View 5-lead SOT23 SCL GND SDA
1 2 3 4 5
Bottom View 8-ball VFBGA WP VCC 8 WP 7 SCL 6 SDA 5
1 2 3 4
VCC
A0 A1 A2 GND
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Bottom View
1.
Absolute Maximum Ratings*
Operating Temperature ............................... -55 to +125C Storage Temperature .................................. -65 to +150C Voltage on Any Pin with Respect to Ground................................. -1.0 to +7.0V Maximum Operating Voltage.................................... 6.25V DC Output Current .................................................. 5.0mA *NOTICE: Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Figure 1-1.
Block Diagram
VCC GND WP SCL SDA START STOP LOGIC
LOAD DEVICE ADDRESS COMPARATOR A2 A1 A0 R/W COMP
SERIAL CONTROL LOGIC
EN
H.V. PUMP/TIMING
DATA RECOVERY INC
LOAD
DATA WORD ADDR/COUNTER
X DEC
EEPROM
Y DEC
SERIAL MUX
DIN DOUT
DOUT/ACK LOGIC
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2. Pin Description
SERIAL CLOCK (SCL): The SCL input is used to positive edge clock data into each EEPROM device and negative edge clock data out of each device. SERIAL DATA (SDA): The SDA pin is bidirectional for serial data transfer. This pin is open-drain driven and may be wire-ORed with any number of other open-drain or open collector devices. DEVICE/ADDRESSES (A2, A1, A0): The A2, A1 and A0 pins are device address inputs that are hard wired or left not connected for hardware compatibility with other Atmel(R) AT24CXX devices. When the pins are hardwired, as many as eight 32K/64K devices may be addressed on a single bus system (device addressing is discussed in detail under the Device Addressing section). If the pins are left floating, the A2, A1 and A0 pins will be internally pulled down to GND if the capacitive coupling to the circuit board VCC plane is <3pF. If coupling is >3pF, Atmel recommends connecting the address pins to GND. WRITE PROTECT (WP): The write protect input, when connected to GND, allows normal write operations. When WP is connected high to VCC, all write operations to the memory are inhibited. If the pin is left floating, the WP pin will be internally pulled down to GND if the capacitive coupling to the circuit board VCC plane is <3pF. If coupling is >3pF, Atmel recommends connecting the pin to GND.
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3.
Memory Organization
Atmel AT24C32D/64D, 32/64K SERIAL EEPROM: The 32K/64K is internally organized as 128/256 pages of 32bytes each. Random word addressing requires a 12-/13-bit data word address.
Table 3-1. Pin Capacitance(1) Applicable over recommended operating range from TA = 25C, f = 1.0MHz, VCC = +1.7V to 5.5V
Symbol CI/O CIN Note: Test Condition Input/Output Capacitance (SDA) Input Capacitance (A0, A1, A2, SCL) 1. This parameter is characterized and is not 100% tested Max 8 6 Units pF pF Conditions VI/O = 0V VIN = 0V
Table 3-2.
DC Characteristics
Applicable over recommended operating range from: TAI = -40 to +85C, VCC = +1.7V to +5.5V (unless otherwise noted)
Symbol VCC1 ICC1 ICC2 ISB1 ILI ILO VIL VIH VOL2 VOL1 Note: Parameter Supply Voltage Supply Current Supply Current Standby Current (+1.7V option) Input Leakage Current VCC = 5.0V Output Leakage Current VCC = 5.0V Input Low Level(1) Input High Level
(1)
Test Condition
Min 1.7
Typ
Max 5.5
Units V mA mA A A A A V V V V
VCC = 5.0V VCC = 5.0V VCC = 1.7V VCC = 5.5V VIN = VCC or VSS VOUT = VCC or VSS
READ at 400kHz WRITE at 400kHz VIN = VCC or VSS
0.4 2.0
1.0 3.0 1.0 6.0
0.10 0.05 0.6 VCC x 0.7
3.0 3.0 VCC x 0.3 VCC + 0.5 0.4 0.2
Output Low Level Output Low Level
VCC = 3.0V VCC = 1.7V
IOL = 2.1mA IOL = 0.15mA
1. VIL min and VIH max are reference only and are not tested
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Table 3-3. AC Characteristics Applicable over recommended operating range from TAI = -40C to +85C, VCC = +1.7V to +5.5V, CL = 1 TTL Gate and 100pF (unless otherwise noted)
1.7V Symbol fSCL tLOW tHIGH ti tAA tBUF tHD.STA tSU.STA tHD.DAT tSU.DAT tR tF tSU.STO tDH tWR Endurance Notes:
(1)
5.0V Max 400 Min Max 1000 0.4 0.4 100 50 0.05 0.5 0.25 0.25 0 100 0.3 300 0.3 100 0.25 50 5 1,000,000 5 0.55 Units kHz s s ns s s s s s ns s ns s ns ms Write Cycles
Parameter Clock Frequency, SCL Clock Pulse Width Low Clock Pulse Width High Noise Suppression Time(1) Clock Low to Data Out Valid Time the bus must be free before a new transmission can start(1) Start Hold Time Start Set-up Time Data In Hold Time Data In Set-up Time Inputs Rise Time Inputs Fall Time
(1)
Min
1.3 0.6
0.05 1.3 0.6 0.6 0 100
0.9
(1)
Stop Set-up Time Data Out Hold Time Write Cycle Time 25C, Page Mode, 3.3V
0.6 50
1. This parameter is ensured by characterization 2. AC measurement conditions: RL (connects to VCC): 1.3k (2.5V, 5.0V), 10k (1.7V) Input pulse voltages: 0.3 VCC to 0.7 VCC Input rise and fall times: 50ns Input and output timing reference voltages: 0.5 VCC
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4.
Device Operation
CLOCK and DATA TRANSITIONS: The SDA pin is normally pulled high with an external device. Data on the SDA pin may change only during SCL low time periods (refer to "Data Validity" diagram). Data changes during SCL high periods will indicate a start or stop condition as defined below. START CONDITION: A high-to-low transition of SDA with SCL high is a start condition which must precede any other command (refer to "Start and Stop Definition" diagram). STOP CONDITION: A low-to-high transition of SDA with SCL high is a stop condition. After a read sequence, the stop command will place the EEPROM in a standby power mode (refer to "Start and Stop Definition" diagram). ACKNOWLEDGE: All addresses and data words are serially transmitted to and from the EEPROM in 8-bit words. The EEPROM sends a zero during the ninth clock cycle to acknowledge that it has received each word. STANDBY MODE: The Atmel(R) AT24C32D/64D features a low power standby mode which is enabled: * Upon power-up * After the receipt of the Stop bit and the completion of any internal operations. SOFTWARE RESET: After an interruption in protocol, power loss or system reset, and 2-wire part can be protocol reset by following these steps: * Create a start bit condition * Clock nine cycles * Create another start bit followed by stop bit condition as shown below. The device is ready for next communication after above steps have been completed.
Figure 4-1.
Software Reset
Start bit 1 2 Dummy Clock Cycles Start bit Stop bit
SCL
3
8
9
SDA
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Figure 4-2. Bus Timing SCL: Serial Clock, SDA: Serial Data I/O
tHIGH tLOW
tF tLOW
tR
SCL
tSU.STA tHD.STA tHD.DAT tSU.DAT tSU.STO
SDA IN
tAA tDH tBUF
SDA OUT
Figure 4-3.
Write Cycle Timing SCL: Serial Clock, SDA: Serial Data I/O
SCL
SDA
8th BIT
ACK
WORDn
twr
STOP CONDITION
(1)
START CONDITION
Notes:
1. The write cycle time tWR is the time from a valid stop condition of a write sequence to the end of the internal clear/write cycle
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Figure 4-4.
Data Validity
SDA
SCL
DATA STABLE
DATA STABLE
DATA CHANGE
Figure 4-5.
Start and Stop Definition
SDA
SCL
START
STOP
Figure 4-6.
Output Acknowledge
SCL
1
8
9
DATA IN
DATA OUT
START
ACKNOWLEDGE
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5. Device Addressing
The 32K/64K EEPROM requires an 8-bit device address word following a start condition to enable the chip for a read or write operation (see Figure 7-1 on page 10 ). The device address word consists of a mandatory one, zero sequence for the first four most significant bits as shown. This is common to all 2-wire EEPROM devices. The 32K/64K uses the three device address bits A2, A1, A0 to allow as many as eight devices on the same bus. These bits must compare to their corresponding hardwired input pins. The A2, A1, and A0 pins use an internal proprietary circuit that biases them to a logic low condition if the pins are allowed to float. The eighth bit of the device address is the read/write operation select bit. A read operation is initiated if this bit is high and a write operation is initiated if this bit is low. Upon a compare of the device address, the EEPROM will output a zero. If a compare is not made, the device will return to standby state. DATA SECURITY: The Atmel(R) AT24C32D/64D has a hardware data protection scheme that allows the user to write protect the entire memory when the WP pin is at VCC.
6.
Write Operations
BYTE WRITE: A write operation requires two 8-bit data word addresses following the device address word and acknowledgment. Upon receipt of this address, the EEPROM will again respond with a zero and then clock in the first 8-bit data word. Following receipt of the 8-bit data word, the EEPROM will output a zero and the addressing device, such as a microcontroller, must terminate the write sequence with a stop condition. At this time the EEPROM enters an internally-timed write cycle, tWR, to the nonvolatile memory. All inputs are disabled during this write cycle and the EEPROM will not respond until the write is complete (see Figure 7-2 on page 10). PAGE WRITE: The 32K/64K EEPROM is capable of 32-byte page writes. A page write is initiated the same way as a byte write, but the microcontroller does not send a stop condition after the first data word is clocked in. Instead, after the EEPROM acknowledges receipt of the first data word, the microcontroller can transmit up to 31 more data words. The EEPROM will respond with a zero after each data word received. The microcontroller must terminate the page write sequence with a stop condition (see Figure 7-3 on page 11). The data word address lower five bits are internally incremented following the receipt of each data word. The higher data word address bits are not incremented, retaining the memory page row location. When the word address, internally generated, reaches the page boundary, the following byte is placed at the beginning of the same page. If more than 32 data words are transmitted to the EEPROM, the data word address will "roll over" and previous data will be overwritten. ACKNOWLEDGE POLLING: Once the internally-timed write cycle has started and the EEPROM inputs are disabled, acknowledge polling can be initiated. This involves sending a start condition followed by the device address word. The read/write bit is representative of the operation desired. Only if the internal write cycle has completed will the EEPROM respond with a zero, allowing the read or write sequence to continue.
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7.
Read Operations
Read operations are initiated the same way as write operations with the exception that the read/write select bit in the device address word is set to one. There are three read operations: current address read, random address read and sequential read. CURRENT ADDRESS READ: The internal data word address counter maintains the last address accessed during the last read or write operation, incremented by one. This address stays valid between operations as long as the chip power is maintained. The address "roll over" during read is from the last byte of the last memory page, to the first byte of the first page. The address "roll over" during write is from the last byte of the current page to the first byte of the same page. Once the device address with the read/write select bit set to one is clocked in and acknowledged by the EEPROM, the current address data word is serially clocked out. The microcontroller does not respond with an input zero but does generate a following stop condition (see Figure 7-4 on page 11). RANDOM READ: A random read requires a "dummy" byte write sequence to load in the data word address. Once the device address word and data word address are clocked in and acknowledged by the EEPROM, the microcontroller must generate another start condition. The microcontroller now initiates a current address read by sending a device address with the read/write select bit high. The EEPROM acknowledges the device address and serially clocks out the data word. The microcontroller does not respond with a zero but does generate a following stop condition (see Figure 7-5 on page 11). SEQUENTIAL READ: Sequential reads are initiated by either a current address read or a random address read. After the microcontroller receives a data word, it responds with an acknowledge. As long as the EEPROM receives an acknowledge, it will continue to increment the data word address and serially clock out sequential data words. When the memory address limit is reached, the data word address will "roll over" and the sequential read will continue. The sequential read operation is terminated when the microcontroller does not respond with a zero but does generate a following stop condition (see Figure 7-6 on page 11). Figure 7-1. Device Address
1 MSB
0
1
0
A2 A1
A0 R/W LSB
Figure 7-2.
S T A R T SDA LINE
Byte Write
W R I T E
DEVICE ADDRESS
FIRST WORD ADDRESS
SECOND WORD ADDRESS
DATA
S T O P
t
M S B LR A S/C BW K M S B A C K LA SC BK A C K
Notes:
1. * = DON'T CARE bits 2. t = DON'T Care bit for Atmel AT24C32D
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Figure 7-3.
S T A R T SDA LINE M S B LR A S/C BW K
Page Write
W R I FIRST SECOND T E WORD ADDRESS (n) WORD ADDRESS (n)
DEVICE ADDRESS
DATA (n)
DATA (n + x)
S T O P
t
A C K A C K A C K A C K
Notes:
1. * = DON'T CARE bits 2. t = DON'T CARE bit for Atmel AT24C32D
Figure 7-4.
S T A R T SDA LINE
Current Address Read
DEVICE ADDRESS
R E A D
S T O P
M S B
LR A S/C BW K
DATA
N O A C K
Figure 7-5.
Random Read
S T A R T W R I T E S T A R T
DEVICE ADDRESS
1st, 2nd WORD ADDRESS n
DEVICE ADDRESS
R E A D
S T O P
SDA LINE M S B LR A S/ C BW K DUMMY WRITE A C K A C K DATA n N O A C K
Notes:
1. * = DON'T CARE bits
Figure 7-6.
Sequential Read
R E A D S T O P
DEVICE ADDRESS SDA LINE
A C K
A C K
A C K
RA /C WK
DATA n
DATA n + 1
DATA n + 2
DATA n + 3
N O A C K
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8.
Ordering Code Detail
AT24C32D-SSHM-B
Atmel Designator Shipping Carrier Option
B or blank = Bulk (tubes) T= Tape and reel
Product Family
Operating Voltage
M = 1.7V to 5.5V
Device Density
32 = 32k 64 = 64k
Package Device Grade or Wafer/Die Thickness
H = Green, NiPdAu lead finish Industrial Temperature range (-40C to +85C) U = Green, matte Sn lead finish Industrial Temperature range (-40C to +85C) 11= 11mil wafer thickness
Device Revision
Package Option
SS = X = MA = ME = ST = C = WWU = WDT = JEDEC SOIC TSSOP UDFN XDFN SOT23 VFBGA Wafer unsawn Die in Tape and Reel
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9.
9.1
Part Markings
Atmel AT24C32D Atmel AT24C32D-SSHM
Top Mark Seal Year | Seal Week | | | |---|---|---|---|---|---|---|---| A T M L H Y W W |---|---|---|---|---|---|---|---| 3 2 D M @ |---|---|---|---|---|---|---|---| * LOT NUMBER |---|---|---|---|---|---|---|---| | PIN 1 INDICATOR (DOT)
Y = SEAL YEAR 8: 2008 2: 9: 2009 3: 0: 2010 4: 1: 2011 5:
2012 2013 2014 2015
WW 02 04 :: :: 50 52
= = = : : = =
SEAL Week Week :::: :::: Week Week
WEEK 2 4 : :: 50 52
@ = Country of Assembly BOTTOM MARK No Bottom Mark
Atmel AT24C32D-XHM
Top Mark PIN 1 INDICATOR (DOT) | |---|---|---|---|---|---| * A T H Y W W |---|---|---|---|---|---| 3 2 D M @ |---|---|---|---|---|---| ATMEL LOT NUMBER |---|---|---|---|---|---|---|
Y = SEAL YEAR 8: 2008 2: 9: 2009 3: 0: 2010 4: 1: 2011 5:
2012 2013 2014 2015
WW 02 04 :: :: 50 52
= = = : : = =
SEAL Week Week :::: :::: Week Week
WEEK 2 4 : :: 50 52
@ = Country of Assembly No Bottom Mark
Atmel AT24C32D-MAHM
Top Mark |---|---|---| 3 2 D |---|---|---| H M @ |---|---|---| Y T C |---|---|---| * | PIN 1 INDICATOR (DOT) Y = YEAR OF ASSEMBLY TC= TRACE CODE (ATMEL LOT NUMBER TO COORESPOND WITH TRACE CODE LOG BOOK) Y = SEAL YEAR 8: 2008 2: 2012 9: 2009 3: 2013 0: 2010 4: 2014 1: 2011 5: 2015
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Atmel AT24C32D-MEHM
Top Mark |---|---|---| 3 2 D |---|---|---| Y T C |---|---|---| * | PIN 1 INDICATOR (DOT) Y = YEAR OF ASSEMBLY TC= TRACE CODE (ATMEL LOT NUMBER TO COORESPOND WITH TRACE CODE LOG BOOK) Y = SEAL YEAR 8: 2008 2: 2012 9: 2009 3: 2013 0: 2010 4: 2014 1: 2011 5: 2015
Atmel AT24C32D-STUM
Top Mark |---|---|---|---|---| B D M W U |---|---|---|---|---| * | PIN 1 INDICATOR (DOT) BD= M= W= U= Device Code Operating Voltage Write Protect Feature Material Set
Line 1 -------->
Bottom Mark |---|---|---|---| Y M T C |---|---|---|---| Y = One Digit Year Code M = Seal Month TC= Trace Code
Atmel AT24C32D-CUM
Top Mark |---|---|---|---| 3 2 D U |---|---|---|---| Y M T C |<--PIN 1 THIS CORNER Y = One Digit Year Code 8: 2008 1: 2011 9: 2009 2: 2012 0: 2010 3: 2013 M A B " J K L = = = " = = = SEAL MONTH (USE ALPHA DESIGNATOR A-L) JANUARY FEBRUARY """""""" OCTOBER NOVEMBER DECEMBER
Line 1 ------->
TC= TRACE CODE (ATMEL LOT NUMBER TO COORESPOND WITH TRACE CODE LOG BOOK) (e.g. XX = AA, AB... YZ, ZZ)
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9.2 Atmel AT24C64D Atmel AT24C64D-SSHM
Top Mark Seal Year | Seal Week | | | |---|---|---|---|---|---|---|---| A T M L H Y W W |---|---|---|---|---|---|---|---| 6 4 D M @ |---|---|---|---|---|---|---|---| * LOT NUMBER |---|---|---|---|---|---|---|---| | PIN 1 INDICATOR (DOT)
Y = SEAL YEAR 8: 2008 2: 9: 2009 3: 0: 2010 4: 1: 2011 5:
2012 2013 2014 2015
WW 02 04 :: :: 50 52
= = = : : = =
SEAL Week Week :::: :::: Week Week
WEEK 2 4 : :: 50 52
@ = Country of Assembly BOTTOM MARK No Bottom Mark
Atmel AT24C64D-XHM
Top Mark PIN 1 INDICATOR (DOT) | |---|---|---|---|---|---| * A T H Y W W |---|---|---|---|---|---| 6 4 D M @ |---|---|---|---|---|---| ATMEL LOT NUMBER |---|---|---|---|---|---|---|
Y = SEAL YEAR 8: 2008 2: 9: 2009 3: 0: 2010 4: 1: 2011 5:
2012 2013 2014 2015
WW 02 04 :: :: 50 52
= = = : : = =
SEAL Week Week :::: :::: Week Week
WEEK 2 4 : :: 50 52
@ = Country of Assembly No Bottom Mark
Atmel AT24C64D-MAHM
Top Mark |---|---|---| 6 4 D |---|---|---| H M @ |---|---|---| Y T C |---|---|---| * | PIN 1 INDICATOR (DOT) Y = YEAR OF ASSEMBLY TC= TRACE CODE (ATMEL LOT NUMBER TO COORESPOND WITH TRACE CODE LOG BOOK) Y = SEAL YEAR 8: 2008 2: 2012 9: 2009 3: 2013 0: 2010 4: 2014 1: 2011 5: 2015
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Atmel AT24C64D-MEHM
Top Mark |---|---|---| 6 4 D |---|---|---| Y T C |---|---|---| * | PIN 1 INDICATOR (DOT) Y = YEAR OF ASSEMBLY TC= TRACE CODE (ATMEL LOT NUMBER TO COORESPOND WITH TRACE CODE LOG BOOK) Y = SEAL YEAR 8: 2008 2: 2012 9: 2009 3: 2013 0: 2010 4: 2014 1: 2011 5: 2015
Atmel AT24C64D-CUM
Top Mark |---|---|---|---| 6 4 D U |---|---|---|---| Y M T C |<--PIN 1 THIS CORNER Y = One Digit Year Code 8: 2008 1: 2011 9: 2009 2: 2012 0: 2010 3: 2013 M A B " J K L = = = " = = = SEAL MONTH (USE ALPHA DESIGNATOR A-L) JANUARY FEBRUARY """""""" OCTOBER NOVEMBER DECEMBER
Line 1 ------->
TC= TRACE CODE (ATMEL LOT NUMBER TO COORESPOND WITH TRACE CODE LOG BOOK) (e.g. XX = AA, AB... YZ, ZZ)
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10. Ordering Codes
Atmel AT24C32D Ordering Information
Ordering Code AT24C32D-SSHM-B (NiPdAu Lead Finish) AT24C32D-SSHM-T(2) (NiPdAu Lead Finish) AT24C32D-XHM-B(1) (NiPdAu Lead Finish) AT24C32D-XHM-T(2) (NiPdAu Lead Finish) AT24C32D-MAHM-T(2) (NiPdAu Lead Finish) AT24C32D-MEHM-T(2) (NiPdAu Lead Finish) AT24C32D-STUM-T(2) AT24C32D-CUM-T(2) AT24C32D-WWU11M(3) Notes: 1. "-B" denotes bulk delivery 2. "-T" denotes tape and reel delivery. SOIC = 4K/reel. TSSOP, UDFN, XDFN, SOT23 and VFBGA = 5K/reel 3. For Wafer sales, please contact Atmel Sales
(1)
Voltage 1.7 to 5.5 1.7 to 5.5 1.7 to 5.5 1.7 to 5.5 1.7 to 5.5 1.7 to 5.5 1.7 to 5.5 1.7 to 5.5 1.7 to 5.5
Package 8S1 8S1 8A2 8A2 8Y6 8ME1 5TS1 8U3-1 Die Sale
Operation Range
Lead-free/Halogen-free Industrial Temperature (-40C to +85C)
Industrial Temperature (-40C to +85C)
Package Type 8S1 8A2 8Y6 8ME1 5TS1 8U3-1 8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC) 8-lead, 4.4mm Body, Plastic, Thin Shrink Small Outline Package (TSSOP) 8-lead, 2.00mm x 3.00mm Body, 0.50mm Pitch, Ultra Thin Dual no Lead Package (UDFN) 8-lead, 1.80mm x 2.20mm Body, (XDFN) 5-lead, 1.60mm Body, Plastic Thin Shrink Small Outline Package (SOT-23) 8-ball, 1.50mm x 2.00mm Body, 0.50mm Pitch, Small Die Ball Grid Array (VFBGA)
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Atmel AT24C64D Ordering Information
Ordering Code AT24C64D-SSHM-B (NiPdAu Lead Finish) AT24C64D-SSHM-T(2) (NiPdAu Lead Finish) AT24C64D-XHM-B(1) (NiPdAu Lead Finish) AT24C64D-XHM-T(2) (NiPdAu Lead Finish) AT24C64D-MAHM-T(2) (NiPdAu Lead Finish) AT24C64D-MEHM-T(2) (NiPdAu Lead Finish) AT24C64D-CUM-T(2) AT24C64D-WWU11M(3) Notes: 1. "-B" denotes bulk delivery 2. "-T" denotes tape and reel delivery. SOIC = 4K/reel. TSSOP, UDFN, XDFN, SOT23 and VFBGA = 5K/reel 3. For Wafer sales, please contact Atmel Sales
(1)
Voltage 1.7 to 5.5 1.7 to 5.5 1.7 to 5.5 1.7 to 5.5 1.7 to 5.5 1.7 to 5.5 1.7 to 5.5 1.7 to 5.5
Package 8S1 8S1 8A2 8A2 8Y6 8ME1 8U3-1 Die Sale
Operation Range
Lead-free/Halogen-free Industrial Temperature (-40C to +85C)
Industrial Temperature (-40C to +85C)
Package Type 8S1 8A2 8Y6 8ME1 8U3-1 8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC) 8-lead, 4.4mm Body, Plastic, Thin Shrink Small Outline Package (TSSOP) 8-lead, 2.00mm x 3.00mm Body, 0.50mm Pitch, Ultra Thin Dual no Lead Package (UDFN) 8-lead, 1.80mm x 2.20mm Body, (XDFN) 8-ball, 1.50mm x 2.00mm Body, 0.50mm Pitch, Small Die Ball Grid Array (VFBGA)
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Atmel AT24C32D/64D
11. Packaging Information
8S1 - JEDEC SOIC
C
1
E
E1
N
L
O
TOP VIEW END VIEW
e b A A1
SYMBOL A A1 b C COMMON DIMENSIONS (Unit of Measure = mm) MIN 1.35 0.10 0.31 0.17 4.80 3.81 5.79 NOM - - - - - - - 1.27 BSC 0.40 0 - - 1.27 8 MAX 1.75 0.25 0.51 0.25 5.05 3.99 6.20 NOTE
D
D E1
SIDE VIEW
Notes: This drawing is for general information only. Refer to JEDEC Drawing MS-012, Variation AA for proper dimensions, tolerances, datums, etc.
E e L
O
5/19/10 TITLE GPC DRAWING NO. 8S1 REV. F
Package Drawing Contact: 8S1, 8-lead (0.150" Wide Body), Plastic Gull packagedrawings@atmel.com Wing Small Outline (JEDEC SOIC)
SWB
19
8717B-SEEPR-6/10
8A2 - TSSOP
3
21
Pin 1 indicator this corner
E1
E
L1
N L
Top View
End View
COMMON DIMENSIONS (Unit of Measure = mm) SYMBOL D MIN 2.90 NOM 3.00 6.40 BSC 4.30 - 0.80 0.19 4.40 - 1.00 - 0.65 BSC 0.45 0.60 1.00 REF 0.75 4.50 1.20 1.05 0.30 4 3, 5 MAX 3.10 NOTE 2, 5
b
A
E E1 A
e D
A2
A2 b e L L1
Side View
Notes:
1. This drawing is for general information only. Refer to JEDEC Drawing MO-153, Variation AA, for proper dimensions, tolerances, datums, etc. 2. Dimension D does not include mold Flash, protrusions or gate burrs. Mold Flash, protrusions and gate burrs shall not exceed 0.15mm (0.006in) per side. 3. Dimension E1 does not include inter-lead Flash or protrusions. Inter-lead Flash and protrusions shall not exceed 0.25mm (0.010in) per side. 4. Dimension b does not include Dambar protrusion. Allowable Dambar protrusion shall be 0.08mm total in excess of the b dimension at maximum material condition. Dambar cannot be located on the lower radius of the foot. Minimum space between protrusion and adjacent lead is 0.07mm. 5. Dimension D and E1 to be determined at Datum Plane H. 5/19/10
TITLE
GPC
DRAWING NO. 8A2
REV. E
Package Drawing Contact: 8A2, 8-lead 4.4mm Body, Plastic Thin packagedrawings@atmel.com Shrink Small Outline Package (TSSOP)
TNR
20
Atmel AT24C32D/64D
8717B-SEEPR-6/10
Atmel AT24C32D/64D
8Y6 - MLP
D2
A
b (8X)
Pin 1 Index Area E2 E
Pin 1 ID L (8X)
D A2 A3 A1
e (6X) 1.50 REF.
COMMON DIMENSIONS (Unit of Measure = mm) SYMBOL MIN NOM MAX NOTE
D E Notes: 1. This drawing is for general information only. Refer to JEDEC Drawing MO-229, for proper dimensions, tolerances, datums, etc. 2. Dimension b applies to metallized terminal and is measured between 0.15mm and 0.30mm from the terminal tip. If the terminal has the optional radius on the other end of the terminal, the dimension should not be measured in that radius area. 3. Soldering the large thermal pad is optional, but not recommended. No electrical connection is accomplished to the device through this pad, so if soldered it should be tied to ground D2 E2 A A1 A2 A3 L e b 0.20 0.20 1.40 - - 0.00 -
2.00 BSC 3.00 BSC 1.50 - - 0.02 - 0.20 REF 0.30 0.50 BSC 0.25 0.30 2
11/21/08
1.60 1.40 0.60 0.05 0.55 0.40
TITLE
GPC
DRAWING NO.
REV.
8Y6, 8-lead, 2.0x3.0mm Body, 0.50mm Pitch, Package Drawing Contact: packagedrawings@atmel.com UltraThin Mini-MAP, Dual No Lead Package (Sawn)(UDFN)
YNZ
8Y6
E
21
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8ME1 - XDFN
D 8 7 6 5
e1 b L
E
PIN #1 ID PIN #1 ID 0.15 0.10
1
2
3
4 A1 A e b
Top View
Side View
Bottom View
COMMON DIMENSIONS (Unit of Measure = mm) SYMBOL MIN NOM MAX NOTE
A A1 D E b e e1 L
- 0.00 1.70 2.10 0.15
- - 1.80 2.20 0.20 0.40 TYP 1.20 REF
0.40 0.05 1.90 2.30 0.25
0.26
0.30
0.35
8/3/09
TITLE
GPC
DRAWING NO. 8ME1
REV. A
8ME1, 8-lead (1.80 x 2.20mm Body) Package Drawing Contact: packagedrawings@atmel.com Extra Thin DFN (XDFN)
DTP
22
Atmel AT24C32D/64D
8717B-SEEPR-6/10
Atmel AT24C32D/64D
5TS1- SOT-23
e1
5 4
C
E1
E
C L
L1
1 2 3
Top View
b
End View
A2
SEATING PLANE
A
e D
A1
COMMON DIMENSIONS (Unit of Measure = mm) SYMBOL MIN NOM MAX NOTE
Side View
Notes: 1. Dimensions D does not include mold flash, protrusions or gate burrs. Mold flash protrusions or gate burrs shall not exceed 0.15mm per end. Dimensions E1 does not include interlead flash or protrusion. Interlead flasg or protrusion shall not exceed 0.15mm per side. 2. The package top may be smaller than the package bottom. Dimensions D and E1 are deteremined at the outermost extremes of the plastic body exclusive of mold flash, tie bar burrs, gate burrs, and interlead flash, but including any mismatch between the top and bottom of the plastic body. 3. These dimensions apply to the flat section of the lead between 0.08mm and 0.15mm from the lead tip. 4. Dimension "b" does not include dambar protrusion. Allowable dambar protrusion shall be 0.80mm total in excess of the "b" dimension at maximum material condition. The dambar cannot be located on the lower radius of the foot. Minimum space between protrusion and an adjacent lead shall not be less than 0.07mm. 5. This drawing is for general information only. Refer to JEDEC Drawing MO-193, Variation AB for additional information.
A A1 A2 c D E E1 L1 e e1 b
- 0.00 0.70 0.08
- - 0.90 - 2.90 BSC 2.80 BSC 1.60 BSC 0.60 REF 0.95 BSC 1.90 BSC
1.10 0.10 1.00 0.20 3 1, 2 1, 2 1, 2
0.30
-
0.50
3, 4
11/05/08
TITLE
GPC
DRAWING NO.
REV.
5TS1, 5-lead, 1.60mm Body, Plastic Thin Package Drawing Contact: packagedrawings@atmel.com Shrink Small Outline Package (Shrink SOT)
TSZ
5TS1
B
23
8717B-SEEPR-6/10
8U3-1 - VFBGA
E
D
1.
b
PIN 1 BALL PAD CORNER
A1 A2 A
Top View
PIN 1 BALL PAD CORNER
1 (d1)
2
3
4
End View
d
SYMBOL
COMMON DIMENSIONS (Unit of Measure = mm) MIN NOM MAX NOTE
A
0.73 0.09 0.40 0.20
0.79 0.14 0.45 0.25 1.50 BSC 2.00 BSC 0.50 BSC 0.25 REF 1.00 BSC 0.25 REF
0.85 0.19 0.50 0.30 2
8 e
7
6
5
A1 A2 b
Bottom View
(e1)
(8 SOLDER BALLS)
D E e e1 d d1
Notes: 1. This drawing is for general information only. 2. Dimension `b' is measured at maximum solder ball diameter. 3. Solder ball composition shall be 95.5Sn-4.0Ag-.5Cu
9/19/07 TITLE DRAWING NO. PO8U3-1 REV. C
Package Drawing Contact: 8U3-1, 8-ball, 1.50 x 2.00mm Body, 0.50mm pitch, packagedrawings@atmel.com VFBGA Package (dBGA2)
24
Atmel AT24C32D/64D
8717B-SEEPR-6/10
Atmel AT24C32D/64D
Revision History
Doc. Rev. 5298B 5298A Date 6/2010 4/2010 Comments Update 8A2 and 8S1 package drawings Remove all PDIP device package references Add SOT23 in feature and description list, pin configuration with note and package drawing Initial document release
25
8717B-SEEPR-6/10
Headquarters
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International
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Product Contact
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8717B-SEEPR-6/10

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